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Article Details

Copyright Statement: This is an open access article licensed under a Creative Commons Attribution 4.0 International License, which permits unrestricted use, distribution, and reproduction in any medium, even commercially as long as the original work is properly cited.

Cost-effective and Green Manufacturing Substrate Integrated Waveguide (SIW) BPF for Wireless Sensor Network Applications

Author 1: Hiba Abdel Ali
Author 2: Rachida Bedira
Author 3: Hichem Trabelsi
Author 4: Ali Gharsallah

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Digital Object Identifier (DOI) : 10.14569/IJACSA.2016.070619

Article Published in International Journal of Advanced Computer Science and Applications(IJACSA), Volume 7 Issue 6, 2016.

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Abstract: This paper presents a comparison between innovative technique for implementation of substrate integrated waveguide band pass filter centered at 4 GHz and conventional PCB results . Two poles filter is designed, simulated and fabricated. The novel fabrication process technique is based on green manufacturing where physical etching of metal layer of aluminum is glued on paper substrate. The pass band filter is composed of two resonant adjacent and symmetric cavities separated by a coupling iris. The same topology is adopted with conventional substrate and PCB technology to validate the new technique results. The bandwidth achieved is almost four times wider than found with PCB technology developed for UWB applications. The proposed technique keeps the advantages of conventional SIW technology including low profile, compact size, complete shielding, easy fabrication, low cost for mass production as well as convenient integration with planar waveguide components including transitions. Moreover, the flexible quality of paper offer the possibility to fabricate conformal shapes of SIW components which is not possible with conventional rigid substrates made with PCB technology . In addition to the advantages of eco friendly, renewable, light weight , and ultra low cost materials

Keywords: Substrate Integrated Waveguide; Band pass filter; Wireless sensor network; green material technology; paper substrate

Hiba Abdel Ali, Rachida Bedira, Hichem Trabelsi and Ali Gharsallah, “Cost-effective and Green Manufacturing Substrate Integrated Waveguide (SIW) BPF for Wireless Sensor Network Applications” International Journal of Advanced Computer Science and Applications(IJACSA), 7(6), 2016. http://dx.doi.org/10.14569/IJACSA.2016.070619

@article{Ali2016,
title = {Cost-effective and Green Manufacturing Substrate Integrated Waveguide (SIW) BPF for Wireless Sensor Network Applications},
journal = {International Journal of Advanced Computer Science and Applications},
doi = {10.14569/IJACSA.2016.070619},
url = {http://dx.doi.org/10.14569/IJACSA.2016.070619},
year = {2016},
publisher = {The Science and Information Organization},
volume = {7},
number = {6},
author = {Hiba Abdel Ali and Rachida Bedira and Hichem Trabelsi and Ali Gharsallah}
}


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