Multi-Exposure Image Fusion based on Window Segmentation and a Laplacian Pyramid for Chip Package Appearance Quality Detection
DOI: https://doi.org/10.14569/IJACSA.2022.0131220
Abstract
Keywords
How to Cite this Article
Hao, F., Song, J., Sun, J., & Fu, Y. (2022). Multi-Exposure Image Fusion based on Window Segmentation and a Laplacian Pyramid for Chip Package Appearance Quality Detection. International Journal of Advanced Computer Science and Applications, 13(12). https://doi.org/10.14569/IJACSA.2022.0131220
Hao, Fei, et al.. "Multi-Exposure Image Fusion based on Window Segmentation and a Laplacian Pyramid for Chip Package Appearance Quality Detection." International Journal of Advanced Computer Science and Applications, vol. 13, no. 12, 2022, https://doi.org/10.14569/IJACSA.2022.0131220.
@article{Hao2022,
title = {Multi-Exposure Image Fusion based on Window Segmentation and a Laplacian Pyramid for Chip Package Appearance Quality Detection},
journal = {International Journal of Advanced Computer Science and Applications},
volume = {13},
number = {12},
year = {2022},
publisher = {The Science and Information Organization},
author = {Fei Hao and Jiatong Song and Jiahao Sun and Yang Fu},
doi = {10.14569/IJACSA.2022.0131220},
url = {https://doi.org/10.14569/IJACSA.2022.0131220}
}
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